Experimental investigation of a copper-water loop heat pipe with additional sources


Аuthors

Pastukhov V. G.*, Maydanik Y. F.**

Institute of Thermal Physics of the Ural Branch of the Russian Academy of Sciences , Amundsena St., 107a Ekaterinburg, 620016, Russia

*e-mail: pastukhov@itp.uran.ru
**e-mail: maidanik@itp.uran.ru

Abstract

The problem of thermal regulation of current electronics is often associated with the presence

of many spatially distributed elements with different power dissipation. Two-phase heat

transfer devices — heat pipes are already widely used in thermal control systems. However, not

all of them are able to effectively remove heat from distributed sources and satisfy the requirements

for weight and size parameters. This paper presents the results of experimental investigations

of a loop heat pipe (LHP) intended for a simultaneous cooling of several heat sources of

different capacity. The LHP had a flat evaporator and a serpentine-shaped condenser joined by a

vapor line and liquid line. The evaporator was in thermal contact with the main heat source.

Two additional, less powerful heat sources were in contact with the heat exchangers located on

the vapor line and the liquid line. The structural material of the LHP and the capillary structure

was copper, and water was used as a working fluid. The LHP efficiency was evaluated by the

ratio of the maximum value of the heat load on the additional sources to the heat load of the

main source. The limiting condition for each of the sources was a temperature of 100°C. Tests

were conducted at a temperature of the liquid cooling the condenser equal 20°C. The maximum

LHP capacity without any additional heat sources was 750 W. It has been shown that at a nominal

heat load on the main source of 400 W the maximum load on the additional source located

on the liquid line was 70 W (17%) and on the source on the vapor line 9 W (~2%).

Keywords:

loop heat pipe, cooling system, heat source, heat exchange.

References

  1. Maydanik Yu.F. Review: Loop heat pipes. Applied Thermal Engineering, 2005, vol. 25, pp. 635–657.
  2. Maydanik Yu., Fershtater Yu., Pastukhov V. Thermoregulation of Loops with Capillary Pumping for Space Use. SAE Paper 921169. 1992. https://doi.org/10.4271/921169
  3. Goncharov K., Golovin O., Kolesnikov V. Loop Heat Pipe with Several Evaporators. SAE Technical Paper 200-01-2407. https://doi.org/10.4271/2000-01-2407
  4. Delil A.A.M., Maydanik Yu.F., Chernysheva M.A., Pastukhov V.G. Development and Test Results of a Multi-Evaporator-Condenser Loop Heat Pipe. National Aerospace Laboratory NLR.NLR-TP-2002-491, 2002.11 p. http://hdl.handle.net/10921/716
  5. Habtour A.M., Nikitkin M.N. Miniature multiple evaporator multiple condenser loop heat pipe. Proc. of the AIAA/USU Conference on Small Satellites. Advanced Technologies III. SSC05-XI-5, 2005, 11 p. https://digitalcommons.usu.edu/smallsat/2005/all2005/65/
  6. Vershinin S.V., Maydanik Y.F. Investigation of pulsations of the operating temperature in a miniature loop heat pipe. Int. J. of Heat Mass Transfer, 2007, vol. 50, pp. 5232–5240.
  7. https://doi.org/10.1016/j.ijheatmasstransfer.2007.06.024
  8. Ku J., Ottenstein L., Birur G. Thermal Performance of a multi-evaporator loop heat pipe with thermal masses and thermoelectric coolers. Proc. of the 13thInt. Heat Pipe Conf.Shanghai. China. September 21-25. 2004, pp. 216–222. https://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/20040171210.pdf
  9. Ku J., Ottenstein L., Douglas D. Miniature loop heat pipe with multiple evaporators for thermal control of small spacecraft. Government Microcircuit Applications and Critical Technology Conference. 2005, paper no. 183. https://www.jpl.nasa.gov/nmp/st8/tech_papers/MLHP%20-GOMAC%20paper.pdf
  10. Chang X.Y., Nagano H. Experimental investigation of loop heat pipe with two evaporators/two condensers under thermal vacuum condition. J. of Applied Mathematics and Physics, 2016, vol.4, pp. 1460–1469. http://dx.doi.org/10.4236/jamp.2016.48151
  11. Ku J. Operating characteristics of loop heat pipes. NASA Goddard Space Flight Center, 29th Int. Conf. on Environmental System. July 12-15. 1999. Denver, Colorado. Paper 1999-01-2007. https://doi.org/10.4271/1999-01-2007
  12. Figus C. Cooling device. Patent WIPO WO2013/092386A1.IPC-F28D15/04.27.06.2013 (Priority number: FR1103954. 20.12.2011).
  13. FigusC., Dandaleix L., Hill J., Barremaecker L. «MULTI-STAGES» loop heat pipe for cooling multiple heat sources. Proc. of Joint 18th IHPC and 12th IHPS, Jeju, Korea. June 12-16. 2016, pp. 27–32.
  14. Fourgeaud L., Raphael M., Dupont V., Figus C. Experimental investigations of a Multi-Source Loop Heat Pipe for electronics cooling. Joint 19th IHPC and 13th IHPS. Pisa. Italy. June 10-14. 2018. https://www.researchgate.net/publication/326588446_Experimental_investigations_of_a_Multi-Source_Loo...
  15. Maydanik Yu.F., Pastukhov V.G. Heat Transfer DeviceFor Cooling Electronic Components. Patent RF, no. 2639635, 2017.
  16. Pastukhov V.G., Maydanik Yu.F. Development and tests of a loop heat pipe with several separate heat sources. Applied Thermal Engineering, 2018, vol. 144, pp. 165–169.
  17. Pastukhov V.G., Maydanik Yu.F. Development and study of a loop heat pipe with several different power heat sources. High Temperature, 2019, vol. 57, no. 5, pp. 734–741. DOI:10.1134/S0040364419050120
  18. Maydanik Yu.F.,Pastukhov V.G., Chernysheva M.A. Review: Loop heat pipe with flat evaporators. Applied Thermal Engineering, 2014, vol. 67, pp. 294–307.



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